page 1 of 9 sgp.15 a specifcation part no. sgp.1575.15.4.a.02 product name gps smt patch antenna features 15mm*15mm*4.5mm 1575mhz centre frequency patent pending rohs compliant spe-11-8-137/c/ss |
page 2 of 9 this ceramic gps patch antenna is based on smart xtremegain tm technology. it is mounted via smt process and has been selected as optimal solution for the 45x45mm ground plane. 1. introduction 2. specifcation original patch specifcation tested on 45mm ground plane **changes in user groundplane and environment will offset centre frequency parameter specifcation notes range of receiving frequency 1575.42 1.023mhz center frequency 1575.42 3mhz with 45*45mm ground plane bandwidth 6mhz min return loss -10 db vswr 1.5 max gain at zenith +1.0 dbic typ. axial ratio 3.0 db max polarization rhcp impedance 50 ohms frequency temperature coeffcient ( t f) 0 20ppm / c -40c to +85c operating temperature -40c to +85c spe-11-8-137/c/ss |
page 3 of 9 3. electrical specifcations 3.1 return loss, swr, impedance, measured on the test fxture center 1 575.420 000 mhz span 100.000 000 mhz 1 1.57542 ghz 3 2 1 3 2 4 ch1 rfl log 5 db / ref 0 db 1:-12.229 db 1 575.420 000 mhz ch3 rfl 1 u f8 1: 31.552 ? -7.8398 ? 12.886 pf ch1 markers bw: 4.843399 mhz cent: 1575.228894 mhz q: 325.23 1 loss: -12.229 db ch3 markers 2: 31.505 ? -7.6631 ? 1.57522 ghz 3: 27.301 ? -9.5859 ? 1.57280 ghz 4: 26.695 ? -7.0801 ? 1.57765 ghz * cor cor > > 27 may 2009 09:19:09 4 spe-11-8-137/c/ss |
page 4 of 9 4. mechanical specifcations 4.1 dimensions and drawing this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design eddie 2012/3/9 a top side bottom name material finish qty sgp.15 patch 15x15x4 ceramic clear 1 1 1 fr4 0.5t green 2 sgp.15 pcb part no. sgp.15 pcb footprint note: this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design kiwi 2011/11/2 a top side bottom name material finish qty sgp.12 patch 12x12x4 ceramic clear 1 1 1 fr 0.5t green 2 sgp.12 pcb part no. sgp.12 pcb footprint pcb thickness 1t f3 amend dimension by 0.5 to 1.0 jaosn 2012/3/1 b b name part no. material finish quantity sgp.15 pcb spe-11-8-137/c/ss |
page 5 of 9 4.2 antenna footprint this drawing and its inherent design concepts are property of taoglas. not to be copied or given to third parties without the written consent of taoglas. tw design centre note: 1.solder mask 2.area to be soldered 3.clearance area 4.diemension of 50 ohm cpw dependent on individual board. 5.must be soldered to complete antenna feed connection. all initial design eddie 2012/3/9 a top side bottom name material finish qty sgp.15 patch 15x15x4 ceramic clear 1 1 1 fr4 0.5t green 2 sgp.15 pcb part no. sgp.15 pcb footprint spe-11-8-137/c/ss |
page 6 of 9 4.3 test jig and dimension spe - 11 - 8 - 137/b/ss page 6 of 8 4 .3 test jig and dimension note: 1. 4mfs.tmd 2. solder area name p/n material finish qty 1 sgp.15 patch 15x15x4 sgp.15a ceramic clear 1 2 31 fr4 1t md 1 3 4.4shihf.po 4.451/.. stt gold 1 spe - 11 - 8 - 137/b/ss page 6 of 8 4 .3 test jig and dimension spe - 11 - 8 - 137/b/ss page 6 of 8 4 .3 test jig and dimension spe-11-8-137/c/ss |
page 7 of 9 4.4 test fixture set up and measurements spec no. sp03ab15756-0030 issued date 2012.01.04 published by version 07 product name sma1575c page 7/8 ? ??????? ??????? ??????? ??????? ?? ?}u?? 16. test jig and dimension xxxx 17. test fixture antenna setup & measurements calibration point network analyzer s11 characteristics log map smith chart 575c sma adapter ground plane spec no. sp03ab15756-0030 issued date 2012.01.04 published by version 07 product name sma1575c page 7/8 ? ??????? ??????? ??????? ??????? ?? ?}u?? 16. test jig and dimension xxxx 17. test fixture antenna setup & measurements calibration point network analyzer s11 characteristics log map smith chart 575c sma adapter ground plane test fixture antenna setup & measurements 45 by 45mm ground plane calibration point patch antenna network analyzer s11 characteristics log map smith chart sma adapter spe-11-8-137/c/ss |
page 8 of 9 5. antenna recommended soldering conditions 5.1 flux, solder 5.2 refow soldering conditions ? use rosin-based fux. dont use highly acidic fux with halide content exceeding 0.2wt%(chlorine conversion value). ? use sn solder. ? pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max. cooling into solvent after soldering also should be in such a way that temperatur e difference is limited to 100 max. unwrought pre-heating may cause cracks on the product, resulting in the deterioration of products quality. temp(c) 240 c 230 c 180 c 0 c 60-120sec 10-30sec time (s) 5 sec (peak 245 c) 5.3 refow with soldering iron ? the following conditions must be strictly followed when using a soldering ir on. pre-heating 150 , 1 min tip temperature 290 max soldering iron output 30w max soldering time 3 second max spe-11-8-137/c/ss |
page 9 of 9 spec no. sp03ab15756-0030 issued date 2012.01.04 published by version 07 product name sma1575c page 8/8 ? ??????? ??????? ??????? ??????? ?? ?}u?? 18. delivery mode 200 pcs / reel / inner carton 5 reels in an outer carton (1000) 6. packaging spe-11-8-137/c/ss |
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